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1 Ergebnisse
1
Micro-solder Fatigue Life Study Based on Crack Propagation ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Bei
;
Xia, Dongmei
;
Liu, Zuyao
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873143
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Micro-solder Fatigue Life Study Based on Crack Propagation Mechanism for High Reliability FC-CSP
UL https://suche.suub.uni-bremen.de/peid=ieee-9873143&Exemplar=1&LAN=DE A1 Wang, Bei A1 Xia, Dongmei A1 Liu, Zuyao A1 Zhang, Long A1 Liao, Chengyu A1 Liu, Lu YR 2022 K1 Geometry K1 Temperature K1 Materials reliability K1 Packaging K1 Fatigue K1 Reliability engineering K1 Data models K1 FC-CSP K1 micro-solder K1 fatigue life K1 FEA K1 crack behavior K1 design parameter SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873143 DO https://doi.org/10.1109/ICEPT56209.2022.9873143 SF ELIB - SuUB Bremen
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