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1
Thermal effects on fracture behaviors of the die-attachment..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Su, Yutai
;
Tu, Bingyi
;
Tang, Ruitao
. - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873144
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Thermal effects on fracture behaviors of the die-attachment in the SiC power device under power cyclic conditions based on fracture phase-field modeling
UL https://suche.suub.uni-bremen.de/peid=ieee-9873144&Exemplar=1&LAN=DE A1 Su, Yutai A1 Tu, Bingyi A1 Tang, Ruitao A1 Long, Xu YR 2022 K1 Power system measurements K1 Silicon carbide K1 Computational modeling K1 Switching frequency K1 Wind power generation K1 Behavioral sciences K1 Thermal analysis K1 Phase-field modeling K1 SiC power device K1 Thermal effects K1 Fracture behaviours SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873144 DO https://doi.org/10.1109/ICEPT56209.2022.9873144 SF ELIB - SuUB Bremen
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