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1 Ergebnisse
1
Reliability study of 3D IC structure under thermal power co..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Yuan, Hang
;
Ma, Haoran
;
Guo, Tianhao
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873145
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Reliability study of 3D IC structure under thermal power consumption load by Finite Element Simulation
UL https://suche.suub.uni-bremen.de/peid=ieee-9873145&Exemplar=1&LAN=DE A1 Yuan, Hang A1 Ma, Haoran A1 Guo, Tianhao A1 Xing, Jing A1 Guo, Ying A1 Ma, Haitao YR 2022 K1 Heating systems K1 Solid modeling K1 Temperature distribution K1 Three-dimensional displays K1 Finite element analysis K1 Thermal loading K1 Integrated circuit modeling K1 3D IC K1 TSV K1 Annad viscoelastic model K1 Finite element method SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873145 DO https://doi.org/10.1109/ICEPT56209.2022.9873145 SF ELIB - SuUB Bremen
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