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1 Ergebnisse
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Atomic-scale study of Cu–Cu direct bonding with assistance ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zheng, Deng-Wu
;
Zhou, Min-Bo
;
Liu, Shuai
.. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873147
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Atomic-scale study of Cu–Cu direct bonding with assistance of Cu nanoparticles as joining medium by molecular dynamics simulation</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873147&Exemplar=1&LAN=DE A1 Zheng, Deng-Wu A1 Zhou, Min-Bo A1 Liu, Shuai A1 Ke, Chang-Bo A1 Zhang, Xin-Ping YR 2022 K1 Nanoparticles K1 Temperature distribution K1 Three-dimensional displays K1 Metallization K1 Sintering K1 Neck K1 Copper K1 Cu–Cu direct bonding K1 Cu nanoparticle K1 sintering K1 molecular dynamics K1 three-dimensional package SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873147 DO https://doi.org/10.1109/ICEPT56209.2022.9873147 SF ELIB - SuUB Bremen
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