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1 Ergebnisse
1
8-inch wafer-level electroplating of nanotwinned copper red..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Xiao
;
Lei, Zhi-Gang
;
Li, Zhe
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873180
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
8-inch wafer-level electroplating of nanotwinned copper redistribution layer for advanced packaging
UL https://suche.suub.uni-bremen.de/peid=ieee-9873180&Exemplar=1&LAN=DE A1 Li, Xiao A1 Lei, Zhi-Gang A1 Li, Zhe A1 Gao, Li-Yin A1 Jia, Zhao-Wei A1 Liu, Zhi-Quan A1 Sun, Rong YR 2022 K1 Electrochemical deposition K1 Semiconductor device reliability K1 Plating K1 Packaging K1 Size measurement K1 Silicon K1 Wafer scale integration K1 wafer-level packaging K1 copper electroplating process K1 nanotwinned microstructure K1 coplanarity SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873180 DO https://doi.org/10.1109/ICEPT56209.2022.9873180 SF ELIB - SuUB Bremen
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