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1 Ergebnisse
1
Stress Analysis of Typical Structure of Redistribution Laye..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zhou, Shilu
;
Zhong, Cheng
;
Shan, Liang
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873188
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Stress Analysis of Typical Structure of Redistribution Layer of Fan-Out Wafer Level Package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873188&Exemplar=1&LAN=DE A1 Zhou, Shilu A1 Zhong, Cheng A1 Shan, Liang A1 Li, Jinhui A1 He, Chuan A1 Huang, Da A1 Lu, Jibao A1 Zhang, Guoping A1 Sun, Rong YR 2022 K1 Thermal expansion K1 Cooling K1 Wires K1 Semiconductor device reliability K1 Electronic packaging thermal management K1 Thermal analysis K1 Finite element analysis K1 Redistribution layer K1 Stress distribution SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873188 DO https://doi.org/10.1109/ICEPT56209.2022.9873188 SF ELIB - SuUB Bremen
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