I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Multiphysics Coupling Analysis and Structural Optimization ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Yong
;
Zhang, Tao
;
Feng, Changlei
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873191
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Multiphysics Coupling Analysis and Structural Optimization of High Density TSVs in Microsystems</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873191&Exemplar=1&LAN=DE A1 Wang, Yong A1 Zhang, Tao A1 Feng, Changlei A1 Zhou, Zheng A1 Xia, JingChao A1 Wu, Peng A1 Zhang, Wei A1 Yang, Li YR 2022 K1 Couplings K1 Silicon compounds K1 Micromechanical devices K1 Heating systems K1 Silicon K1 Parametric statistics K1 Finite element analysis K1 orthogonal parametric modeling K1 TSV K1 thermal-mechanical coupling K1 SiO2 isolation layer K1 stress superposition K1 maximum equivalent stress SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873191 DO https://doi.org/10.1109/ICEPT56209.2022.9873191 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
