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1 Ergebnisse
1
A Laser Assisted Bonding Process Design with Silver-indium ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Song, Jiaqi
;
Hu, Shizun
;
Liu, Yu
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873195
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A Laser Assisted Bonding Process Design with Silver-indium Transient Liquid Phase Method for the Infrared Detectors Hermetic Packaging</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873195&Exemplar=1&LAN=DE A1 Song, Jiaqi A1 Hu, Shizun A1 Liu, Yu A1 Ge, Anxu A1 Zhang, Donglin A1 Zhao, Xiuchen A1 Huo, Yongjun YR 2022 K1 Heating systems K1 Temperature sensors K1 Liquids K1 Packaging K1 Laser modes K1 Finite element analysis K1 Bonding K1 Infrared detectors K1 Laser assisted transient liquid phase bonding K1 Silver-indium SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873195 DO https://doi.org/10.1109/ICEPT56209.2022.9873195 SF ELIB - SuUB Bremen
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