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1 Ergebnisse
1
QFP solder joint bending stress analysis and parameter opti..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Liu, Xianjia
;
Huang, Chunyue
;
Wang, Lilin
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873197
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>QFP solder joint bending stress analysis and parameter optimization under constant temperature field conditions</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873197&Exemplar=1&LAN=DE A1 Liu, Xianjia A1 Huang, Chunyue A1 Wang, Lilin A1 Wu, Liye A1 Liu, Xiaobin A1 Zhang, Huaiquan YR 2022 K1 Analytical models K1 Temperature distribution K1 Bending K1 Software K1 Finite element analysis K1 Soldering K1 Stress K1 QFP package K1 bending stress K1 constant temperature field K1 range analysis K1 optimal combination SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873197 DO https://doi.org/10.1109/ICEPT56209.2022.9873197 SF ELIB - SuUB Bremen
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