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1 Ergebnisse
1
Strain and Deformation of Flip Chip with Underfill at High ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zhang, Zhen'an
;
Zhong, Cheng
;
Peng, Xu
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873204
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Strain and Deformation of Flip Chip with Underfill at High Temperature: In-situ Characterization and Finite Element Analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873204&Exemplar=1&LAN=DE A1 Zhang, Zhen'an A1 Zhong, Cheng A1 Peng, Xu A1 Li, Gang A1 Lu, Jibao A1 Sun, Rong A1 Peng, Liang A1 Zhu, Pengli YR 2022 K1 Deformable models K1 Analytical models K1 Temperature distribution K1 Materials reliability K1 Reliability engineering K1 Behavioral sciences K1 Flip-chip devices K1 Finite Element Analysis (FEA) K1 electronic package K1 flip chip K1 reliability K1 Digital Image Correlation (DIC) K1 underfill SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873204 DO https://doi.org/10.1109/ICEPT56209.2022.9873204 SF ELIB - SuUB Bremen
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