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Analysis of the effects of thermo-mechanical stress on the ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Xiaorui, Bie ; Xudong, Zou ; Xingyin, Xiong... - p. 1-7 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873218