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1 Ergebnisse
1
Development and Characterization of Epoxy Molding Compound ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zou, Qiang
;
Xie, Guangchao
;
Lei, Guangyin
.. - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873223
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Development and Characterization of Epoxy Molding Compound with High Glass Transition Temperature</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873223&Exemplar=1&LAN=DE A1 Zou, Qiang A1 Xie, Guangchao A1 Lei, Guangyin A1 Ding, Quanqing A1 Zhan, Will YR 2022 K1 Temperature K1 Silicon carbide K1 Thermomechanical processes K1 Epoxy resins K1 Glass K1 Curing K1 Electromagnetic compatibility K1 epoxy molding compound K1 silicon carbide K1 electronics packaging K1 glass transition temperature SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873223 DO https://doi.org/10.1109/ICEPT56209.2022.9873223 SF ELIB - SuUB Bremen
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