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1 Ergebnisse
1
Design and verification of a new electromagnetic shielding ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Huang, Haichao
;
Zhao, Dongyan
;
Chen, Yanning
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873224
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Design and verification of a new electromagnetic shielding material suitable for QFP packaging
UL https://suche.suub.uni-bremen.de/peid=ieee-9873224&Exemplar=1&LAN=DE A1 Huang, Haichao A1 Zhao, Dongyan A1 Chen, Yanning A1 Fu, Zhen A1 Wang, Shuaipeng A1 Cheng, Xiaofeng YR 2022 K1 Instruments K1 Epoxy resins K1 Curing K1 Reflection K1 Stability analysis K1 Filling K1 Electromagnetic shielding K1 Electromagnetic shielding material K1 Chip packaging K1 Epoxy resin SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873224 DO https://doi.org/10.1109/ICEPT56209.2022.9873224 SF ELIB - SuUB Bremen
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