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1 Ergebnisse
1
Effect of twin spacing on coefficient of thermal expansion ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Lu, Shan
;
Wu, Yunwen
;
Hang, Tao
. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873229
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Effect of twin spacing on coefficient of thermal expansion of (111)-oriented nano-twinned copper: A molecular dynamics simulation study</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873229&Exemplar=1&LAN=DE A1 Lu, Shan A1 Wu, Yunwen A1 Hang, Tao A1 Li, Ming YR 2022 K1 Thermal expansion K1 Three-dimensional displays K1 Simulation K1 Crystals K1 Electronic packaging thermal management K1 Stability analysis K1 Through-silicon vias K1 (111)-oriented nano-twinned Cu K1 coefficient of thermal expansion K1 the twin spacing K1 through-silicon via SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873229 DO https://doi.org/10.1109/ICEPT56209.2022.9873229 SF ELIB - SuUB Bremen
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