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1 Ergebnisse
1
Study on the Coverage of Metal Thermal Interface Material f..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Luo, Yuxuan
;
Wang, Feng
;
Wang, Weilun
.. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873241
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Study on the Coverage of Metal Thermal Interface Material for Ultra-Large FCBGA Packaging
UL https://suche.suub.uni-bremen.de/peid=ieee-9873241&Exemplar=1&LAN=DE A1 Luo, Yuxuan A1 Wang, Feng A1 Wang, Weilun A1 Mei, Na A1 Fang, Jianmin YR 2022 K1 Simulation K1 Packaging K1 Electronic packaging thermal management K1 Thermal analysis K1 Finite element analysis K1 Indium K1 Flip-chip devices K1 FCBGA K1 Metal TIM K1 Coverage K1 Warpage SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873241 DO https://doi.org/10.1109/ICEPT56209.2022.9873241 SF ELIB - SuUB Bremen
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