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Research on the influence of parallel seam welding paramete..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Yang, Zhen-tao
;
Chen, Jiang-tao
;
Liu, Lin-jie
. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873244
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Research on the influence of parallel seam welding parameters on the reliability of thin-walled ceramic package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873244&Exemplar=1&LAN=DE A1 Yang, Zhen-tao A1 Chen, Jiang-tao A1 Liu, Lin-jie A1 Shi, Peng-yuan YR 2022 K1 Porcelain K1 Welding K1 Simulation K1 Thermal shock K1 Reliability theory K1 Electronic packaging thermal management K1 Software K1 HTCC K1 parallel seam welding K1 reliability K1 thermal simulation K1 the thin-walled packages SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873244 DO https://doi.org/10.1109/ICEPT56209.2022.9873244 SF ELIB - SuUB Bremen
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