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1 Ergebnisse
1
A high-remelting-point interconnect method based on porous ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Jianqiang
;
Wang, Haozhong
;
Lv, Ziwen
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873247
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
A high-remelting-point interconnect method based on porous copper and Sn42Bi58 solder
UL https://suche.suub.uni-bremen.de/peid=ieee-9873247&Exemplar=1&LAN=DE A1 Wang, Jianqiang A1 Wang, Haozhong A1 Lv, Ziwen A1 Zhong, Xiangxiang A1 Mao, Xingchao A1 Chen, Hongtao YR 2022 K1 Temperature distribution K1 Liquids K1 Process control K1 Packaging K1 Skeleton K1 Temperature control K1 Copper K1 porous copper K1 Sn42Bi58 solder K1 step soldering K1 high temperature package K1 transient liquid phase bonding SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873247 DO https://doi.org/10.1109/ICEPT56209.2022.9873247 SF ELIB - SuUB Bremen
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