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A high-remelting-point interconnect method based on porous ..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jianqiang ; Wang, Haozhong ; Lv, Ziwen... - p. 1-4 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873247