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1 Ergebnisse
1
Effect of reflow temperature and time on the interfacial re..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Gao, Xing
;
Zhang, Zhi-Jie
;
Shi, Quan
.. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873250
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Effect of reflow temperature and time on the interfacial reaction of Sn-xCu/(001) Cu
UL https://suche.suub.uni-bremen.de/peid=ieee-9873250&Exemplar=1&LAN=DE A1 Gao, Xing A1 Zhang, Zhi-Jie A1 Shi, Quan A1 Wei, Hong A1 Zhou, Xu YR 2022 K1 Temperature distribution K1 Temperature dependence K1 Metallization K1 Morphology K1 Crystals K1 Lead K1 Market research K1 single crystal (111) Cu K1 intermetallic compounds K1 interfacial reaction K1 reflow temperature K1 solder composition SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873250 DO https://doi.org/10.1109/ICEPT56209.2022.9873250 SF ELIB - SuUB Bremen
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