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A Method to Measure Residual Stress of Liquid Molding Compo..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Zhang, Mengdi ; Ai, Wenji ; Xie, Xin... - p. 1-4 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873255