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1 Ergebnisse
1
A Method to Measure Residual Stress of Liquid Molding Compo..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zhang, Mengdi
;
Ai, Wenji
;
Xie, Xin
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873255
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
A Method to Measure Residual Stress of Liquid Molding Compound by In-Situ Characterizations
UL https://suche.suub.uni-bremen.de/peid=ieee-9873255&Exemplar=1&LAN=DE A1 Zhang, Mengdi A1 Ai, Wenji A1 Xie, Xin A1 Fu, Kexin A1 Zhu, Pengli A1 Sun, Rong YR 2022 K1 Liquids K1 Materials reliability K1 Curing K1 Bending K1 Packaging K1 Market research K1 Residual stresses K1 Liquid Molding Compound (LMC) K1 residual stress K1 fracture toughness (KIC) K1 strain gauge SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873255 DO https://doi.org/10.1109/ICEPT56209.2022.9873255 SF ELIB - SuUB Bremen
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