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1 Ergebnisse
1
Enhanced Thermal Stress Reliability of Photodetector Device..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Xi, JianFei
;
Wang, Xiaolin
;
Tao, ZiChun
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873256
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Enhanced Thermal Stress Reliability of Photodetector Devices Based on Thermal-Mechanical Simulation and Temperature Cycling Experiments</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873256&Exemplar=1&LAN=DE A1 Xi, JianFei A1 Wang, Xiaolin A1 Tao, ZiChun A1 Lu, HaiLong A1 Wah, Chew Chee A1 TawMing, Lau A1 Lu, HuiFen A1 Liang, TongYue A1 YanTu YR 2022 K1 Silicon compounds K1 Performance evaluation K1 Wires K1 Packaging K1 Electronic packaging thermal management K1 Photodetectors K1 Thermal analysis K1 Photodetector K1 thermo-mechanical modeling K1 reliability K1 electrical-optical characterization SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873256 DO https://doi.org/10.1109/ICEPT56209.2022.9873256 SF ELIB - SuUB Bremen
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