I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Stress analysis and optimization of microscale CSP solder j..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Lilin
;
Huang, Chunyue
;
Liu, Xianjia
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873262
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Stress analysis and optimization of microscale CSP solder joint under high temperature bending compound Loading</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873262&Exemplar=1&LAN=DE A1 Wang, Lilin A1 Huang, Chunyue A1 Liu, Xianjia A1 Wu, Liye A1 Liu, Xiaobin A1 Zhang, Huaiquan YR 2022 K1 Analytical models K1 Solid modeling K1 Welding K1 Bending K1 Response surface methodology K1 Soldering K1 Chip scale packaging K1 3D packaging K1 CSP solder joints K1 Finite element analysis K1 High temperature bending composite load K1 Response surface method SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873262 DO https://doi.org/10.1109/ICEPT56209.2022.9873262 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
