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1 Ergebnisse
1
Interfacial Delamination Characterization and Thermo-mechan..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Chen, Bin
;
Wang, Hong-Guang
;
Lyu, Guang-Chao
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873264
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Interfacial Delamination Characterization and Thermo-mechanical Reliability of Stacked Die Package by Finite Element Analysis</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873264&Exemplar=1&LAN=DE A1 Chen, Bin A1 Wang, Hong-Guang A1 Lyu, Guang-Chao A1 Yang, Bing-Xian A1 Hu, Wei-Lin A1 Zhang, Xin-Ping YR 2022 K1 Three-dimensional displays K1 Force K1 Electronic packaging thermal management K1 Stability analysis K1 Finite element analysis K1 Thermal loading K1 Delamination K1 Stacked die package K1 Interfacial crack K1 Virtual crack closure technique SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873264 DO https://doi.org/10.1109/ICEPT56209.2022.9873264 SF ELIB - SuUB Bremen
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