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1 Ergebnisse
1
Optimization Design Method of Array Solder Joint Layout Bas..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Yuan, Lirong
;
Lin, Kabin
;
Xue, Song
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873268
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Optimization Design Method of Array Solder Joint Layout Based on Stress Mean Square Deviation
UL https://suche.suub.uni-bremen.de/peid=ieee-9873268&Exemplar=1&LAN=DE A1 Yuan, Lirong A1 Lin, Kabin A1 Xue, Song A1 Yao, Songjie A1 Min, Zhixian A1 Pan, Chenghui A1 Wang, Benben A1 Jiang, Ruiqi A1 Luan, Tian A1 Zhang, Daxing A1 Wang, Congsi YR 2022 K1 Costs K1 Adaptive systems K1 Layout K1 Integrated circuit interconnections K1 Packaging K1 Reliability theory K1 Iterative methods K1 Electronic packaging K1 Iterative optimization K1 reliability SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873268 DO https://doi.org/10.1109/ICEPT56209.2022.9873268 SF ELIB - SuUB Bremen
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