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Transient liquid phase bonding of Sn-Pb solder with added N..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Wang, Jiaxing ; Yao, Quanbin ; Lin, Pengrong... - p. 1-6 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873278