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1 Ergebnisse
1
The coupling relationship between thermal conductivity and ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wen, Zhibin
;
Ji, Yinggang
;
Pang, Yunsong
... - p. 1-3 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873280
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
The coupling relationship between thermal conductivity and the toughness in thermal interface materials
UL https://suche.suub.uni-bremen.de/peid=ieee-9873280&Exemplar=1&LAN=DE A1 Wen, Zhibin A1 Ji, Yinggang A1 Pang, Yunsong A1 Ai, Daifeng A1 Xu, Yonglun A1 Ren, Linlin A1 Zeng, Xiaoliang A1 Sun, Rong YR 2022 K1 Couplings K1 Thermal expansion K1 Radar K1 Conductivity K1 Thermal conductivity K1 Electronic packaging thermal management K1 Thermal management K1 Thermal interface materials K1 Facture toughness SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873280 DO https://doi.org/10.1109/ICEPT56209.2022.9873280 SF ELIB - SuUB Bremen
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