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Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pad..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Lo, Jeffery C. C. ; Jiang, Qian ; Qiu, Xing.. - p. 1-4 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873290