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1 Ergebnisse
1
Finite element and phase field simulation methods for homog..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Xiong, Zishan
;
Zhao, Xiuchen
;
Yu, Jiexun
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873304
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Finite element and phase field simulation methods for homogenization and electromigration properties of solid-liquid low-temperature welding joints</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873304&Exemplar=1&LAN=DE A1 Xiong, Zishan A1 Zhao, Xiuchen A1 Yu, Jiexun A1 Qiao, Pengyi A1 Wei, Yuhang A1 Tan, Chengwen YR 2022 K1 Electromigration K1 Solid modeling K1 Welding K1 Wires K1 Predictive models K1 Mathematical models K1 Soldering K1 Solid-liquid diffusion welding K1 Low-temperature welding K1 Homogeneity K1 Bi segregation K1 Multiphysics simulation SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873304 DO https://doi.org/10.1109/ICEPT56209.2022.9873304 SF ELIB - SuUB Bremen
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