I agree that this site is using cookies. You can find further informations
here
.
X
Login
Merkliste (
0
)
Home
About us
Home About us
Our history
Profile
Press & public relations
Friends
The library in figures
Exhibitions
Projects
Training, internships, careers
Films
Services & Information
Home Services & Information
Lending and interlibrary loans
Returns and renewals
Training and library tours
My Account
Library cards
New to the library?
Download Information
Opening hours
Learning spaces
PC, WLAN, copy, scan and print
Catalogs and collections
Home Catalogs and Collections
Rare books and manuscripts
Digital collections
Subject Areas
Our sites
Home Our sites
Central Library
Law Library (Juridicum)
BB Business and Economics (BB11)
BB Physics and Electrical Engineering
TB Engineering and Social Sciences
TB Economics and Nautical Sciences
TB Music
TB Art & Design
TB Bremerhaven
Contact the library
Home Contact the library
Staff Directory
Open access & publishing
Home Open access & publishing
Reference management: Citavi & RefWorks
Publishing documents
Open Access in Bremen
zur Desktop-Version
Toggle navigation
Merkliste
1 Ergebnisse
1
Interface Adhesion Effect of Anchoring Polymer Layer Anisot..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Pan, Yan
;
Peng, Xiaohui
;
Zhu, Pengli
.. - p. 1-3 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873307
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Interface Adhesion Effect of Anchoring Polymer Layer Anisotropic Conductive Films on the Bending Reliability for Ultra-fine Pitch Wearable Chip-on-Flex Packages</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873307&Exemplar=1&LAN=DE A1 Pan, Yan A1 Peng, Xiaohui A1 Zhu, Pengli A1 Sun, Rong A1 Paik, Kyung-Wook YR 2022 K1 Adhesives K1 Wearable computers K1 Integrated circuit interconnections K1 Materials reliability K1 Bending K1 Contact resistance K1 Polymers K1 Interface adhesion K1 Anchoring polymer layer K1 Anisotropic conductive films K1 COF packages SP 1 OP 3 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873307 DO https://doi.org/10.1109/ICEPT56209.2022.9873307 SF ELIB - SuUB Bremen
Export
RefWorks (nur Desktop-Version!)
Flow
(Zuerst in
Flow
einloggen, dann importieren)
