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1 Ergebnisse
1
Stress Analysis Optimization And Prediction Of Stack BGA So..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Maolin
;
Huang, Chun-Yue
;
Wang, Zhuo
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873309
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Stress Analysis Optimization And Prediction Of Stack BGA Solder Joints Under Random Vibration Conditions
UL https://suche.suub.uni-bremen.de/peid=ieee-9873309&Exemplar=1&LAN=DE A1 Li, Maolin A1 Huang, Chun-Yue A1 Wang, Zhuo A1 Zhang, Huaiquan A1 Gong, Jinfeng A1 Liao, Shuaidong YR 2022 K1 Vibrations K1 Analytical models K1 Predictive models K1 Data models K1 Finite element analysis K1 Regression analysis K1 Soldering K1 Stack BGA solder joints K1 Vibration loading K1 Stress-strain K1 Orthogonal design K1 Extreme difference K1 Stress prediction SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873309 DO https://doi.org/10.1109/ICEPT56209.2022.9873309 SF ELIB - SuUB Bremen
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