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Influence of capillary trace on the wire bond loop profile:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Lai, Jia-Jun ; Xia, Liang ; Hu, Rui... - p. 1-5 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873313