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1 Ergebnisse
1
Chip-Package interaction stress analysis and optimization f..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Han, Shunfeng
;
Li, Dejian
;
Feng, Xi
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873316
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Chip-Package interaction stress analysis and optimization for a 14nm extreme low-k chip of FCCSP package</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873316&Exemplar=1&LAN=DE A1 Han, Shunfeng A1 Li, Dejian A1 Feng, Xi A1 Guan, Yuan A1 Li, Bofu A1 Li, Dameng A1 Liu, Yunting A1 Liu, Fengman YR 2022 K1 Simulation K1 Thermal conductivity K1 Electronic packaging thermal management K1 Finite element analysis K1 Thermal analysis K1 Structural engineering K1 Stress K1 Chip-Package interaction K1 ELK K1 submodeling K1 chip thickness K1 PSV opening K1 PI opening K1 bump size SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873316 DO https://doi.org/10.1109/ICEPT56209.2022.9873316 SF ELIB - SuUB Bremen
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