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Numerical Study of Microchannel Heat Sink Using Water-Al2O3..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Tan, Zewen ; Li, Fang ; Liu, Ziteng. - p. 1-4 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873317