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1 Ergebnisse
1
Analysis of typical high speed link based on Through Silico..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Hao, Wen
;
Song, LiZhen
;
Jie, LiBing
.. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873327
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Analysis of typical high speed link based on Through Silicon Via in three-dimensional Integration System</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873327&Exemplar=1&LAN=DE A1 Hao, Wen A1 Song, LiZhen A1 Jie, LiBing A1 Na, LiuXue A1 Min, Miao YR 2022 K1 Couplings K1 Wiring K1 Computational modeling K1 Crosstalk K1 Integrated circuit interconnections K1 Insertion loss K1 Propagation losses K1 Through Silicon Via (TSV) K1 Signal integrity K1 High speed link SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873327 DO https://doi.org/10.1109/ICEPT56209.2022.9873327 SF ELIB - SuUB Bremen
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