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1 Ergebnisse
1
Indium-based Flip-chip Interconnection for Superconducting ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Yu, Jiexun
;
Zheng, Yao
;
Zhou, Shengjuan
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873338
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Indium-based Flip-chip Interconnection for Superconducting Quantum Computing Application</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873338&Exemplar=1&LAN=DE A1 Yu, Jiexun A1 Zheng, Yao A1 Zhou, Shengjuan A1 Wang, Qian A1 Wu, Sishi A1 Wu, Haihua A1 Li, Tiefu A1 Cai, Jian YR 2022 K1 Resistance K1 Superconducting integrated circuits K1 Superconducting transmission lines K1 Qubit K1 Packaging K1 Microwave theory and techniques K1 Flip-chip devices K1 superconducting K1 qubit K1 flip chip K1 indium K1 quantum packaging SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873338 DO https://doi.org/10.1109/ICEPT56209.2022.9873338 SF ELIB - SuUB Bremen
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