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1 Ergebnisse
1
Finite Element Analysis of Power Module Packages with One-s..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Li, Xiao
;
Tang, Jiuyang
;
Zhao, Jiayan
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873343
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Finite Element Analysis of Power Module Packages with One-step Molding for Power Inductors</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873343&Exemplar=1&LAN=DE A1 Li, Xiao A1 Tang, Jiuyang A1 Zhao, Jiayan A1 Li, Jinbing A1 Zhang, Guoqi A1 Liu, Pan YR 2022 K1 Semiconductor device measurement K1 Powders K1 Magnetic separation K1 Multichip modules K1 Permeability measurement K1 Permeability K1 Finite element analysis K1 Finite element simulation K1 Power module packaging K1 Relative Permeability K1 Thermal management SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873343 DO https://doi.org/10.1109/ICEPT56209.2022.9873343 SF ELIB - SuUB Bremen
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