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Study on the Hygrothermal Reliability of Underfill/Passivat..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Li, Zhipeng ; Wu, Wenjie ; Wang, Bin... - p. 1-5 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873346