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1 Ergebnisse
1
A new Cu/Ni/Ag preform solder for die attachment of power e..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Xu, Hengyi
;
Zang, Likun
;
Wang, Sheng
.. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873353
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>A new Cu/Ni/Ag preform solder for die attachment of power electronics</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873353&Exemplar=1&LAN=DE A1 Xu, Hengyi A1 Zang, Likun A1 Wang, Sheng A1 Xu, Hongyan A1 Xu, Ju YR 2022 K1 Nanoparticles K1 Resistance K1 Electric potential K1 Powders K1 Preforms K1 Sintering K1 Power electronics K1 low-temperature sintering K1 lead-free interconnection K1 Cu/Ni/Ag preform K1 anti-oxidation SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873353 DO https://doi.org/10.1109/ICEPT56209.2022.9873353 SF ELIB - SuUB Bremen
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