I agree that this site is using cookies. You can find further informations here.
X
Merkliste 
 1 Ergebnisse 
 
1

Large area pressureless Cu-Cu bonding using formic acid-tre..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
Xu, Yu ; Dai, Dongfang ; Yang, Renbin... - p. 1-3 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873355