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1 Ergebnisse
1
Nondestructive Laser Debonding of Designable Responsive and..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Fangcheng
;
Liu, Qiang
;
Wang, Xuefan
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873356
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Nondestructive Laser Debonding of Designable Responsive and Buffer Layers for Wafer Level Packaging
UL https://suche.suub.uni-bremen.de/peid=ieee-9873356&Exemplar=1&LAN=DE A1 Wang, Fangcheng A1 Liu, Qiang A1 Wang, Xuefan A1 Li, Jinhui A1 Zhang, Guoping A1 Sun, Rong YR 2022 K1 Buffer layers K1 Shock waves K1 Semiconductor lasers K1 Packaging K1 Thermal conductivity K1 Wafer scale integration K1 Manufacturing K1 temporary bonding/debonding K1 laser debonding K1 structural design K1 wafer level packaging SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873356 DO https://doi.org/10.1109/ICEPT56209.2022.9873356 SF ELIB - SuUB Bremen
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