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1 Ergebnisse
1
Effect of Underfill Fillet Height on Packaging Reliability ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zhao, Guolin
;
Zhang, Ruoyu
;
Zhong, Cheng
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873371
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Effect of Underfill Fillet Height on Packaging Reliability in Flip Chip</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873371&Exemplar=1&LAN=DE A1 Zhao, Guolin A1 Zhang, Ruoyu A1 Zhong, Cheng A1 Li, Gang A1 Zhu, Pengli A1 Sun, Rong A1 Zhu, Wenhui YR 2022 K1 Geometry K1 Thermal expansion K1 Adhesives K1 Packaging K1 Filling K1 Flip-chip devices K1 Reliability K1 Underfill K1 Fillet height K1 Flip chip K1 Packaging reliability SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873371 DO https://doi.org/10.1109/ICEPT56209.2022.9873371 SF ELIB - SuUB Bremen
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