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1 Ergebnisse
1
Effect of pulse off time on microstructure and properties o..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Yu-Xi
;
Gao, Li-Yin
;
Wan, Yong-Qiang
.. - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873374
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Effect of pulse off time on microstructure and properties of twinned copper films by pulse electrodeposition</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873374&Exemplar=1&LAN=DE A1 Wang, Yu-Xi A1 Gao, Li-Yin A1 Wan, Yong-Qiang A1 Liu, Zhi-Quan A1 Sun, Rong YR 2022 K1 X-ray scattering K1 Films K1 Surface morphology K1 X-ray diffraction K1 Mechanical factors K1 Surface topography K1 Copper K1 pulse electrodeposition K1 twinned copper K1 microstructure and properties SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873374 DO https://doi.org/10.1109/ICEPT56209.2022.9873374 SF ELIB - SuUB Bremen
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