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1 Ergebnisse
1
Moisture Desorption and Hygro-Vapor-Thermal Induced Interfa..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zheng, Long
;
Deng, Yun-Kai
;
Wang, Hong-Guang
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873388
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Moisture Desorption and Hygro-Vapor-Thermal Induced Interfacial Delamination in Underfilled FCBGA Package During Reflow Process</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873388&Exemplar=1&LAN=DE A1 Zheng, Long A1 Deng, Yun-Kai A1 Wang, Hong-Guang A1 Lyu, Guang-Chao A1 Yang, Bing-Xian A1 Hu, Wei-Lin A1 Zhang, Xin-Ping YR 2022 K1 Absorption K1 Thermomechanical processes K1 Two dimensional displays K1 Moisture K1 Finite element analysis K1 Polymers K1 Thermal loading K1 Underfilled FCBGA K1 moisture K1 hygroscopic swelling K1 interface delamination K1 crack propagation K1 reflow SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873388 DO https://doi.org/10.1109/ICEPT56209.2022.9873388 SF ELIB - SuUB Bremen
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