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1 Ergebnisse
1
Large-area Die Attachment and the Surface Finish Effect on ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wang, Chun-Meng
;
Hou, Bin
;
Deng, Yun-Kai
.. - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873390
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Large-area Die Attachment and the Surface Finish Effect on Bonding Strength of Joints in High-power Electronics Using a Low-temperature Sinterable Cu Nanoparticle Paste</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873390&Exemplar=1&LAN=DE A1 Wang, Chun-Meng A1 Hou, Bin A1 Deng, Yun-Kai A1 Zhou, Min-Bo A1 Zhang, Xin-Ping YR 2022 K1 Electric potential K1 Semiconductor devices K1 Sintering K1 Packaging K1 Power electronics K1 Nitrogen K1 Microstructure K1 power electronics K1 die attachment K1 Cu nanoparticle paste K1 pressureless K1 surface finish SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873390 DO https://doi.org/10.1109/ICEPT56209.2022.9873390 SF ELIB - SuUB Bremen
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