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1 Ergebnisse
1
Three-dimensional Finite Element Analysis of Interfacial De..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Lyu, Guang-Chao
;
Zhou, Min-Bo
;
Zhang, Xin-Ping
- p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873416
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Three-dimensional Finite Element Analysis of Interfacial Delamination in Molded Underfill Flip-Chip Packages by Virtual Crack Closure Technique</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873416&Exemplar=1&LAN=DE A1 Lyu, Guang-Chao A1 Zhou, Min-Bo A1 Zhang, Xin-Ping YR 2022 K1 Shape K1 Simulation K1 Force K1 Finite element analysis K1 Behavioral sciences K1 Flip-chip devices K1 Delamination K1 molded underfill package K1 interfacial delamination K1 fracture mechanics K1 strain energy release rate K1 phase angle SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873416 DO https://doi.org/10.1109/ICEPT56209.2022.9873416 SF ELIB - SuUB Bremen
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