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Influences of Organic Acids in the Soldering Flux System on..:

, In: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT),
He, Huan ; Fang, Shu ; Qin, Jun-Hu.. - p. 1-6 , 2022
Link: https://doi.org/10.1109/ICEPT56209.2022.9873445