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1 Ergebnisse
1
Thermal-Mechanical Analysis of TSV Array in 2.5D Silicon In..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Zou, Bao
;
Ren, Xingang
;
Cai, Xueyuan
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873475
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Thermal-Mechanical Analysis of TSV Array in 2.5D Silicon Interposer</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873475&Exemplar=1&LAN=DE A1 Zou, Bao A1 Ren, Xingang A1 Cai, Xueyuan A1 Sun, Guoxing A1 Cui, Yongxin A1 Huang, Zhixiang YR 2022 K1 Silicon compounds K1 Insulation K1 Silicon K1 Thermal analysis K1 Copper K1 Through-silicon vias K1 Stress K1 2.5D Si interposer K1 TSV K1 Thermal stress K1 Thermal resistance K1 Thermal mechanical reliability SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873475 DO https://doi.org/10.1109/ICEPT56209.2022.9873475 SF ELIB - SuUB Bremen
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