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1 Ergebnisse
1
Investigation on The Relationship between Fracture Toughnes..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wu, Wenjie
;
Li, Zhipeng
;
Peng, Tao
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873488
RT T1 <cTitle>2022 23rd International Conference on Electronic Packaging Technology (ICEPT)</cTitle>: T1 <Title>Investigation on The Relationship between Fracture Toughness of Underfill and The Chemical State of Filler Surface at Different Temperatures</Title> UL https://suche.suub.uni-bremen.de/peid=ieee-9873488&Exemplar=1&LAN=DE A1 Wu, Wenjie A1 Li, Zhipeng A1 Peng, Tao A1 Yang, Liu A1 Wang, Ning A1 Li, Gang A1 Peng, Xiaohui A1 Yu, Xuecheng A1 Zhu, Pengli YR 2022 K1 Nanoparticles K1 Silicon compounds K1 Couplings K1 Scanning electron microscopy K1 Temperature K1 Behavioral sciences K1 Surface cracks K1 underfill K1 fracture toughness K1 surface modification K1 nanoparticles SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873488 DO https://doi.org/10.1109/ICEPT56209.2022.9873488 SF ELIB - SuUB Bremen
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