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1 Ergebnisse
1
Investigation of bias stress degradation of Depletion-Mode ..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Guo, Chenrun
;
Zhou, Bin
;
Lai, Canxiong
... - p. 1-5 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873497
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Investigation of bias stress degradation of Depletion-Mode (D-Mode) AlGaN/GaN HEMT
UL https://suche.suub.uni-bremen.de/peid=ieee-9873497&Exemplar=1&LAN=DE A1 Guo, Chenrun A1 Zhou, Bin A1 Lai, Canxiong A1 Jian, Xiaodong A1 Dong, Xianshan A1 Dai, Xuanjun YR 2022 K1 Degradation K1 Performance evaluation K1 Logic gates K1 HEMTs K1 Threshold voltage K1 Wide band gap semiconductors K1 Leakage currents K1 Reliability K1 electrical degradation K1 AlGaN/GaN HEMT SP 1 OP 5 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873497 DO https://doi.org/10.1109/ICEPT56209.2022.9873497 SF ELIB - SuUB Bremen
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