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1 Ergebnisse
1
Stress-Strain Analysis and Parameter Optimization of Sop So..:
, In:
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
,
Wu, Liye
;
Huang, Chunyue
;
Liu, Xiaobin
... - p. 1-6 , 2022
Link:
https://doi.org/10.1109/ICEPT56209.2022.9873524
RT T1
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)
: T1
Stress-Strain Analysis and Parameter Optimization of Sop Solder Joints under Random Vibration
UL https://suche.suub.uni-bremen.de/peid=ieee-9873524&Exemplar=1&LAN=DE A1 Wu, Liye A1 Huang, Chunyue A1 Liu, Xiaobin A1 Wang, Lilin A1 Liu, Xianjia A1 Zhang, Huaiquan YR 2022 K1 Vibrations K1 Analytical models K1 Loading K1 Software K1 Response surface methodology K1 Structural engineering K1 Soldering K1 sop solder joint K1 random vibration K1 response surface K1 optimization SP 1 OP 6 LK http://dx.doi.org/https://doi.org/10.1109/ICEPT56209.2022.9873524 DO https://doi.org/10.1109/ICEPT56209.2022.9873524 SF ELIB - SuUB Bremen
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