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1
The Delamination Caused by Flux Residue in System-in-Packag..:
, In:
2022 36th Symposium on Microelectronics Technology (SBMICRO)
,
Alaferdov, Andrei
;
Yoshioka, Ricardo
;
Nunes, Carolina C. P.
... - p. 1-4 , 2022
Link:
https://doi.org/10.1109/SBMICRO55822.2022.9880986
RT T1
2022 36th Symposium on Microelectronics Technology (SBMICRO)
: T1
The Delamination Caused by Flux Residue in System-in-Package Devices
UL https://suche.suub.uni-bremen.de/peid=ieee-9880986&Exemplar=1&LAN=DE A1 Alaferdov, Andrei A1 Yoshioka, Ricardo A1 Nunes, Carolina C. P. A1 Sousa, Matheus Dias A1 Carvalho, Valdeci A1 Namba, Igor Fernandes A1 Coral, Claudemir YR 2022 K1 Accelerometers K1 Electron traps K1 System-in-package K1 Electronic components K1 Electromagnetic compatibility K1 Microelectronics K1 Delamination K1 flux residue K1 delamination K1 system-in-package K1 underfill SP 1 OP 4 LK http://dx.doi.org/https://doi.org/10.1109/SBMICRO55822.2022.9880986 DO https://doi.org/10.1109/SBMICRO55822.2022.9880986 SF ELIB - SuUB Bremen
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